HSINCHU, Taiwan–(BUSINESS WIRE)–TSMC (TWSE: 2330, NYSE: TSM) is unveiling its newest improvements in superior logic expertise, specialty applied sciences, and TSMC 3DFabric™ superior packaging and chip stacking applied sciences on the Firm’s 2021 Know-how Symposium. Going down on-line for a second yr, the symposium connects clients with TSMC’s new choices, together with N6RF for next-generation 5G smartphone and WiFi 6/6e efficiency, N5A for state-of-the-art automotive functions, and enhancements throughout the vary of 3DFabric applied sciences. Over 5,000 clients and expertise companions around the globe have registered for our 2021 Know-how Symposium, being held from June 1-2.
“Digitalization is remodeling society sooner than ever as folks use expertise to beat the limitations created by the worldwide pandemic to attach, collaborate, and resolve issues,” stated Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a brand new world filled with alternatives for the semiconductor business. Our world Know-how Symposium highlights lots of the methods we’re enhancing and increasing our expertise portfolio to unleash our clients’ improvements.”
Superior Know-how Management – N5, N4, N5A, and N3
TSMC was first within the business to deliver 5 nanometer (nm) expertise into quantity manufacturing in 2020 with defect density enhancing sooner than the previous 7nm technology. The N4 enhancement to the 5nm household additional improves efficiency, energy effectivity and transistor density together with the discount of masks layers and shut compatibility in design guidelines with N5. TSMC N4 improvement has proceeded easily since its announcement on the 2020 Know-how Symposium, with danger manufacturing set for the third quarter of 2021.
TSMC is introducing N5A, the most recent member of the 5nm household; the N5A course of is geared toward satisfying the rising demand for computing energy in newer and extra intensive automotive functions reminiscent of AI-enabled driver help and the digitization of car cockpits. N5A brings the identical expertise utilized in supercomputers right now to autos, packing the efficiency, energy effectivity, and logic density of N5 whereas assembly the stringent high quality and reliability necessities of AEC-Q100 Grade 2 in addition to different automotive security and high quality requirements. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be obtainable in third quarter of 2022.
TSMC’s N3 expertise is poised to be the world’s most superior expertise when it begins quantity manufacturing within the second half of 2022. Counting on the confirmed FinFET transistor structure for the very best efficiency, energy effectivity, and value effectiveness, N3 will provide as much as 15% velocity acquire or eat as much as 30% much less energy than N5, and supply as much as 70% logic density acquire.
Superior Radio Frequency Know-how for the 5G Period – N6RF
5G smartphones require extra silicon space and eat extra energy to ship increased wi-fi knowledge charges in contrast with 4G. 5G enabled chips combine extra performance and parts and are more and more rising in measurement and competing towards the battery for a restricted quantity of house contained in the smartphone.
TSMC debuted the N6RF course of, which brings the facility, efficiency, and space advantages of its superior N6 logic course of to 5G radio frequency (RF) and WiFi 6/6e options. N6RF transistors obtain greater than 16% increased efficiency over the prior technology of RF expertise at 16nm. Moreover, N6RF helps important energy and space discount for 5G RF transceivers for each sub-6 gigahertz and millimeter wave spectrum bands with out compromising efficiency, options and battery life provided to shoppers. TSMC N6RF will even improve WiFi 6/6e efficiency and energy effectivity.
TSMC 3DFabric System Integration Options
TSMC continues to develop its complete 3DFabric household of 3D silicon stacking and superior packaging applied sciences.
- For top-performance computing functions, TSMC might be providing bigger reticle-size for each its InFO_oS and CoWoS® packaging options in 2021, enabling bigger ground plans for chiplet and high-bandwidth reminiscence integration. Moreover, the chip-on-wafer (CoW) model of TSMC-SoIC™ might be certified on N7-on-N7 this yr with manufacturing focused for 2022 at a brand new fully-automated manufacturing facility.
- For cell functions, TSMC is introducing its InFO_B resolution, designed to combine a strong cell processor in a slim, compact package deal with enhanced efficiency and energy effectivity and help cell gadget makers’ DRAM stacking on the package deal.
TSMC pioneered the pure-play foundry enterprise mannequin when it was based in 1987, and has been the world’s main devoted semiconductor foundry ever since. The Firm helps a thriving ecosystem of world clients and companions with the business’s main course of applied sciences and portfolio of design enablement options to unleash innovation for the worldwide semiconductor business. With world operations spanning Asia, Europe, and North America, TSMC serves as a dedicated company citizen around the globe.
TSMC deployed 281 distinct course of applied sciences, and manufactured 11,617 merchandise for 510 clients in 2020 by offering broadest vary of superior, specialty and superior packaging expertise providers. TSMC is the primary foundry to offer 5-nanometer manufacturing capabilities, essentially the most superior semiconductor course of expertise obtainable on the planet. The Firm is headquartered in Hsinchu, Taiwan. For extra info please go to https://www.tsmc.com.